That's always an issue, but the industry seems to be moving away from 2D circuits.<p>Reducing trace length seems to be the way forward for faster/larger circuits. Signal propagation time on-die is becoming an issue.<p>Things like Huawei's Logic folding, or TSVs, and so on, attack the issue by reducing signal travel time.<p>This looks like another building block in that direction.<p>There's also some push at cooling chips from both sides.